location: Current position: Home >> Scientific Research >> Paper Publications

Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application

Hits:

Indexed by:Journal Papers

Date of Publication:2019-03-29

Journal:Ultrasonics Sonochemistry

Included Journals:SCI、EI

Volume:33

Page Number:10-17

Note:SCI一区,IF:4.959

Pre One:在金属基底上制作高深宽比金属微光栅的方法

Next One:A novel MEMS omnidirectional inertial switch with flexible electrodes