The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation
Release Time:2016-12-06 Hits:
Indexed by: Journal Papers
Date of Publication: 2019-03-29
Journal: Journal of Applied Polymer Science
Included Journals: EI、SCI
Volume: 127
Issue: 6
Page Number: 4456-4462
Note: JCR二区，IF：1.866（2015）