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The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation

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Indexed by:Journal Papers

Date of Publication:2019-03-29

Journal:Journal of Applied Polymer Science

Included Journals:SCI、EI

Volume:127

Issue:6

Page Number:4456-4462

Note:JCR二区，IF：1.866（2015）

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