location： Current position: Home >> Scientific Research >> Paper Publications

Enhancing the adhesion strength between Cu substrate and Ni layer in microelectroforming

Hits:

Indexed by:Journal Papers

Date of Publication:2014-07-01

Journal:Materials and Manufacturing Processes

Included Journals:SCI、EI

Volume:29

Issue:7

Page Number:795-800

Note:JCR二区，IF：1.419（2015）

Pre One:Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process

Next One:Research of megasonic electroforming equipment based on the uniformity of electroforming process
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep