Enhancing the adhesion strength between Cu substrate and Ni layer in microelectroforming
Release Time:2016-12-06 Hits:
Indexed by: Journal Papers
Date of Publication: 2014-07-01
Journal: Materials and Manufacturing Processes
Included Journals: EI、SCI
Volume: 29
Issue: 7
Page Number: 795-800
Note: JCR二区，IF：1.419（2015）