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Residual stress modeling and analysis for micro electroforming layer

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Indexed by:Journal Papers

Date of Publication:2017-10-01

Journal:Microsystem Technologies

Included Journals:SCI、EI

Volume:23

Issue:10

Page Number:4709-4716

Pre One:Research of megasonic electroforming equipment based on the uniformity of electroforming process

Next One:Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation
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