Current position: Home >> Scientific Research >> Paper Publications

Fabrication of high-aspect-ratio stepped Cu microcolumn array using UV-LIGA technology

Release Time:2024-06-30  Hits:

Indexed by: Journal Papers

Document Code: 370424

Date of Publication: 2023-07-18

Journal: MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Volume: 29

Issue: 7

Page Number: 999-1014

ISSN: 0946-7076

Key Words: MASS-TRANSFER; PHOTORESIST

Prev One:微惯性开关制作过程中界面结合强度研究

Next One:Study on the uniformity of microgrooves in through-mask electrochemical micromachining with moving cathode