Release Time:2024-06-30 Hits:
Date of Publication: 2022-10-09
Journal: 真空与低温
Volume: 26
Issue: 2
Page Number: 131-138
ISSN: 1006-7086
Note: 新增回溯数据
Prev One:Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process
Next One:金属基底上三维可动微机构的制作