Hits:
Date of Publication:2022-10-09
Journal:真空与低温
Volume:26
Issue:2
Page Number:131-138
ISSN No.:1006-7086
Note:新增回溯数据
Pre One:Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process
Next One:金属基底上三维可动微机构的制作