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一种提高注塑成型PMMA微流控芯片热压键合率的方法

Release Time:2019-03-09  Hits:

First Author: 杜立群

Disigner of the Invention: Chong Liu,付其达,常宏玲

Application Number: CN201110079543.3

Authorization Date: 2011-03-24

Authorization Number: CN102190287A

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