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一种微流控芯片热流道注塑成型模具

Release Time:2019-03-09  Hits:

First Author: 宋满仓

Disigner of the Invention: Chong Liu,Minjie wang,杜立群,庞中华,刘莹

Application Number: CN201010300409.7

Authorization Date: 2010-01-18

Authorization Number: CN101786317A

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