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一种适用于大尺寸、高密集结构金属微通道散热器的键合封装方法

Release Time:2020-08-02  Hits:

First Author: 杜立群

Disigner of the Invention: 姬学超,魏壮壮,朱和卿,赵雯,宋满仓,翟科

Authorization Number: ZL 201811070961.4

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