Release Time:2019-03-11  Hits:

Indexed by: Conference Paper

Date of Publication: 2011-08-08

Included Journals: Scopus、CPCI-S、EI

Page Number: 342-345

Abstract: The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250 degrees C. At higher soldering temperatures such as 275 degrees C and 300 degrees C, faceted grains were dominant and the other two were mainly discovered under smaller cooling rates. Simultaneously, large plate-like Ag3Sn formed in virtue of interfacial Cu6Sn5 under furnace cooling, which was discussed based on the solidification sequence.