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Paper Publications

[91]Zhao, N., Huang, M. L., Zhong, Y., Ma, H. T., Pan, X. M., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(1):345-352
[92]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Solde...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(1):467-474
[93]Huang, M. L., Zhang, Z. J., Ma, H. T., Chen, L. D., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2014,30(12):1235-1242
[94]Li, Y. S., Ma, H. T., Yang, L. Z., Zhang, C. Z., Feng, R. F., Q., Hirose, A., YS (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Competitive graphitization and diamond growth on hot-dip aluminized carbon steel substrate[J],APPLIED SURFACE SCIENCE,2014,314:1041-1046
[95]Zhao, N., Huang, M. L., Ma, H. T., Yang, F., Zhang, Z. J., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Influence of Rare Earth Ce Addition on the Microstructure, Properties and Soldering Reaction of...[J],METALS AND MATERIALS INTERNATIONAL,2014,20(5):953-958
[96]Kunwar, Anil, Ma, Haitao, Sun, Junhao, Qu, Lin, Li, Shuang, Liu, Jiahui.A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder[A],2014,602-605
[97]Li, Shuang, Du, Yao, Qu, Lin, Kunwar, Anil, Sun, Junhao, Liu, Jiahui, Zhao, Ning, Huang, Mingliang, Ma, Haitao.The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows[A],2014,937-939
[98]Liu, Jiahui, Ma, Haitao, Li, Shuang, Sun, Junhao, Kunwar, Anil, Miao, Wang, Hao, Jianjie, Bao, Yanpeng.The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu la...[A],2014,949-952
[99]Sun, Junhao, Du, Yao, Kunwar, Anil, Qu, Lin, Li, Shuang, Liu, Jiahui, Ma, H. T., Guo, Binfeng.In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu inte...[A],2014,976-979
[100]Li, Y. S., Yang, Q., Hirose, A., L. Z., Ma, H. T., Feng, R. F., YS (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Enhanced diamond deposition on Kovar alloy substrate with Al interlayer[J],MATERIALS RESEARCH INNOVATIONS,2014,18:979-982

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