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论文类型：期刊论文

发表时间：2015-10-01

发表刊物：SCRIPTA MATERIALIA

收录刊物：SCIE、EI、Scopus

卷号：107

页面范围：88-91

ISSN号：1359-6462

关键字：Electromigration; Synchrotron radiation; Inter-metallic compound; Finite volume method; Level-set variable

摘要：Synchrotron radiation imaging technology was applied for in situ observation of the growth of Cu6Sn5 intermetallic compounds at the anode in Cu/molten Sn/Cu joint undergoing electromigration. For current density of 0.6 x 10(3) A/cm(2), temperature of 250 degrees C and reflow heating time of 1 h, thickness of the compound was obtained as 110 gm. The thickness growth was observed to have linear dependence with time. The numerical model for diffusion and electromigration of the copper species was implemented using the finite volume method. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.