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年产5万片6英寸导电型和半绝缘型碳化硅(SiC)衬底建设项目

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Leading Scientist:梁红伟

Project Participants:zhaoyu,Luo Yingmin,liuyang,zhanghezhi,zhangkexiong,Zhang Zhenzhong,Shen Rensheng,zhangheqiu,xiaxiaochuan

Supported by:国务院其他部门

Status:在研

Supported by:北京天科合达半导体股份有限公司

Nature of Project:纵向

Project Approval Number:CEIEC-2020-ZM02-0598

Date of Project Approval:2021-01-01

Scheduled completion time:2022-12-31

Date of Project Initiation:2021-01-01

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