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年产5万片6英寸导电型和半绝缘型碳化硅(SiC)衬底建设项目

Release Time:2021-08-25  Hits:

Leading Scientist: 梁红伟

Project Participants: 赵宇,Luo Yingmin,柳阳,张赫之,张克雄,张振中,申人升,张贺秋,夏晓川

Project Source: 国务院其他部门

Status: 已提已提交结题报告

Supported by: Beijing Tiankeheda Semiconductor Co., Ltd.

Nature of Project: 纵向

Project Approval Number: CEIEC-2020-ZM02-0598

Date of Project Approval: 2021-01-01

Scheduled Completion Time: 2022-12-31

Date of Project Initiation: 2021-01-01

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