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Journal:ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
Volume:13
Issue:4
ISSN No.:2162-8769
Key Words:BEHAVIOR; CMP; IMPACT; MATERIAL REMOVAL; MICRO-TEXTURE; MODEL; PERFORMANCE; SILICA
Next One:Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method