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论文类型：期刊论文

发表时间：2013-01-01

发表刊物：INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

收录刊物：SCIE、EI

卷号：64

页面范围：31-37

ISSN号：0890-6955

关键字：Silicon wafer; Wafer thinning; Diamond grinding; Edge chipping

摘要：Although diamond grinding is the most commonly used machining technique in silicon wafer thinning, it often induces edge chipping which leads to wafer breakage. This study investigates edge chipping of silicon wafer in diamond grinding. The study correlates edge chipping with the crystallographic orientation and thickness of a silicon wafer, as well as grinding process conditions, such as wheel grit size, grinding mode and feed rate. It identifies edge chipping in terms of critical thickness, geometry and dimensions. The study discusses the mechanisms of edge chipping based on machining mechanics and energy theories. Conclusions are drawn to summarize the study. (C) 2012 Elsevier Ltd. All rights reserved.