|
个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
扫描关注
- [101]高尚, 康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
- [102]Gao, Shang, Wu, Yueqin, Kang, Renke, Huang, Han, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
- [103]朱祥龙, 李俊卿, 董志刚, 康仁科, 高尚, 郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],2018
- [104]Wu, Y. Q., Gao, S., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],Materials Science in Semiconductor Processing,2017,71(-):321-325
- [105]朱祥龙, 高尚, 康仁科, 董志刚, 崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
- [106]王紫光, 高尚, 朱祥龙, 董志刚, 康仁科, Kang, Ren-Ke(Kangrk@dlut.edu.cn).硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
- [107]Gao, Shang, Huang, Han, Zhu, Xianglong, Kang, Renke, RK (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
- [108]高尚, 王紫光, 张璧, 朱祥龙, 康仁科, 郭东明, Kang, Renke(kangrk@dlut.edu.cn).微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2017,53(7):180-188
- [109]Gao, Shang, Wang, Zi-Guang, Zhang, Bi, Dong, Zhi-Gang, Kang, Ren-Ke, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2017,32(2):121-126
- [110]高尚, 康仁科, 董志刚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],2017,872:19-24
- [111]高尚, 王紫光, 康仁科, 董志刚, 张璧, Kang, Renke(kangrk@dlut.edu.cn).工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2016,52(17):86-93
- [112]于月滨, 王紫光, 周平, 高尚, 郭东明, Zhou, P., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina, email: pzhou@dlut.edu.cn.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,36(3):1-5,10
- [113]林智富, 高尚, 康仁科, 王紫光, 耿宗超, Gao, S., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina, email: gaoshangf@gmail.com.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,45(5):1317-1322
- [114]Dong, Zhigang, Gao, Shang, Huang, Han, Kang, Renke, Wang, Ziguang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,83(5-8):1231-1239
- [115]Liu, Haijun, Dong, Zhigang, Kang, Renke, Zhou, Ping, Gao, Shang, ZG (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining, Minist Educ, 2 Linggong Rd, Dalian 116024, Peoples R China..ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],METROLOGY AND MEASUREMENT SYSTEMS,2015,22(4):531-546
- [116]高尚, 康仁科, 朱祥龙, 郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],2015
- [117]高尚, 康仁科, 张璧, 郭东明, 董志刚.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
- [118]董志刚, 高尚, 康仁科, 郭东明.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
- [119]高尚, 康仁科, 郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],2014,117(-):544-548
- [120]Gao, Shang, Dong, Zhigang, Kang, Renke, Guo, Dongming, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, 2 Linggong Rd, Dalian 116023, Peoples R China..Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586