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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
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- [101]林智富, 高尚, 康仁科, 王紫光, 耿宗超, Gao, S., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina, email: gaoshangf@gmail.com.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,45(5):1317-1322
- [102]Dong, Zhigang, Gao, Shang, Huang, Han, Kang, Renke, Wang, Ziguang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,83(5-8):1231-1239
- [103]Liu, Haijun, Dong, Zhigang, Kang, Renke, Zhou, Ping, Gao, Shang, ZG (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining, Minist Educ, 2 Linggong Rd, Dalian 116024, Peoples R China..ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],METROLOGY AND MEASUREMENT SYSTEMS,2015,22(4):531-546
- [104]高尚, 康仁科, 朱祥龙, 郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],2015
- [105]高尚, 康仁科, 张璧, 郭东明, 董志刚.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
- [106]董志刚, 高尚, 康仁科, 郭东明.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
- [107]高尚, 康仁科, 郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],2014,117(-):544-548
- [108]Gao, Shang, Dong, Zhigang, Kang, Renke, Guo, Dongming, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, 2 Linggong Rd, Dalian 116023, Peoples R China..Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586
- [109]高尚, 康仁科, 董志刚, 郭东明, Kang, R.(kangrk@dlut.edu.cn).工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2013,49(3):88-94
- [110]Gao, Shang, Kang, Renke, Dong, Zhigang, Zhang, B., S (reprint author), Dalian Univ Technol, Inst Adv Mfg Technol, Sch Mech Engn, Minist Educ, Key Lab Precis & Nontradit Machining Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2013,64:31-37
- [111]白倩, 董志刚, 闫英, 高尚, 朱祥龙, 段春争, 刘冲, 崔岩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163