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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
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- [81]于月滨, 王紫光, 周平, 高尚, 郭东明.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,3:1-5,10
- [82]高尚, 李洪刚, 康仁科, 张瑜, 董志刚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],Micromachines,2021,12(1)
- [83]刘志强, 康仁科, 刘海军, 董志刚, 鲍岩, 高尚, 朱祥龙.FEM-based optimization approach to machining strategyfor thin-walled parts made of hard and britt...[J],The International Journal of Advanced Manufacturing Technology,2021,110(5-6):1399-1413
- [84]Yang, Guolin, 董志刚, 高尚, Bao, Yan, 康仁科, 郭东明.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2021,253
- [85]李子源, 高尚, 康仁科, 李洪刚, 郭晓光.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2020,10(2):122-133
- [86]高尚, 吴跃勤, 王紫光, 康仁科, 耿宗超.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(5):186-195
- [87]王紫光, 康仁科, 周平, 高尚, 董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
- [88]Cai, Linquan, Guo, Xiaoguang, Gao, Shang, Li, Zhiyuan, Kang, Renke, S (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2019,45(16):20545-20554
- [89]Gao, Shang, Dong, Zhigang, Kang, Renke, Zhang, Bi, Guo, Dongming, S (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2015,40:87-93
- [90]Wu, Y. Q., Gao, S., Kang, R. K., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2019,54(3):1958-1966
- [91]Gao, Shang, Huang, Han, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Recent advances in micro- and nano-machining technologies[J],FRONTIERS OF MECHANICAL ENGINEERING,2017,12(1,SI):18-32
- [92]高尚, 康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
- [93]Gao, Shang, Wu, Yueqin, Kang, Renke, Huang, Han, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
- [94]朱祥龙, 李俊卿, 董志刚, 康仁科, 高尚, 郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],2018
- [95]Wu, Y. Q., Gao, S., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],Materials Science in Semiconductor Processing,2017,71(-):321-325
- [96]朱祥龙, 高尚, 康仁科, 董志刚, 崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
- [97]王紫光, 高尚, 朱祥龙, 董志刚, 康仁科, Kang, Ren-Ke(Kangrk@dlut.edu.cn).硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
- [98]Gao, Shang, Huang, Han, Zhu, Xianglong, Kang, Renke, RK (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
- [99]高尚, 王紫光, 张璧, 朱祥龙, 康仁科, 郭东明, Kang, Renke(kangrk@dlut.edu.cn).微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2017,53(7):180-188
- [100]Gao, Shang, Wang, Zi-Guang, Zhang, Bi, Dong, Zhi-Gang, Kang, Ren-Ke, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2017,32(2):121-126