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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
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- [81]高尚, Li, Honggang, 康仁科, He, Yiwei, 朱祥龙.新一代半导体材料氧化镓单晶的制备方法及其超精密加工技术研究进展[J],Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,57(9):213-232
- [82]王紫光, 康仁科, 周平, 高尚, 董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
- [83]林智富, 高尚, 康仁科, 王紫光, 耿宗超.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,5:1317-1322
- [84]白倩, 董志刚, 闫英, 高尚, 朱祥龙, 段春争, 刘冲, 崔岩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163
- [85]朱祥龙, 李俊卿, 董志刚, 康仁科, 高尚, 郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],6th International Conference on Nanomanufacturing,2018
- [86]朱祥龙, 高尚, 康仁科, 董志刚, 崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
- [87]王紫光, 高尚, 朱祥龙, 董志刚, 康仁科.硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
- [88]高尚, 康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
- [89]高尚, 耿宗超, 吴跃勤, 王紫光, 康仁科.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(05):186-195
- [90]于月滨, 王紫光, 周平, 高尚, 郭东明.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,3:1-5,10
- [91]高尚, 李洪刚, 康仁科, 张瑜, 董志刚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],Micromachines,2021,12(1)
- [92]刘志强, 康仁科, 刘海军, 董志刚, 鲍岩, 高尚, 朱祥龙.FEM-based optimization approach to machining strategyfor thin-walled parts made of hard and britt...[J],The International Journal of Advanced Manufacturing Technology,2021,110(5-6):1399-1413
- [93]Yang, Guolin, 董志刚, 高尚, Bao, Yan, 康仁科, 郭东明.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2021,253
- [94]李子源, 高尚, 康仁科, 李洪刚, 郭晓光.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2020,10(2):122-133
- [95]高尚, 吴跃勤, 王紫光, 康仁科, 耿宗超.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(5):186-195
- [96]王紫光, 康仁科, 周平, 高尚, 董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
- [97]Cai, Linquan, Guo, Xiaoguang, Gao, Shang, Li, Zhiyuan, Kang, Renke, S (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2019,45(16):20545-20554
- [98]Gao, Shang, Dong, Zhigang, Kang, Renke, Zhang, Bi, Guo, Dongming, S (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2015,40:87-93
- [99]Wu, Y. Q., Gao, S., Kang, R. K., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2019,54(3):1958-1966
- [100]Gao, Shang, Huang, Han, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Recent advances in micro- and nano-machining technologies[J],FRONTIERS OF MECHANICAL ENGINEERING,2017,12(1,SI):18-32