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Paper Publications

[11]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[12]Ma, Haoran, Haitao, Zhao, Ning, Huang, Mingliang, Wang, Yunpeng, Chen, Jun, Liu, Zhiyuan, Kunwar, Anil, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[13]Zhao, N., Wang, M. Y., Zhong, Y., Ma, H. T., Y. P., Wong, C. P., N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[14]Kunwar, Anil, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
[15]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[16]Ji, Shengnan, Wang, Chen, Yunpeng, Ma, Haitao, Zhao, Ning.Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective bac...[A],2018,396-399
[17]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Song, Xueguan, Malla, Prafulla Bahadur, Ma, Haitao, Wang, Yunpeng.A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes[A],2018,1329-1332
[18]Kunwar Anil, Raback Peter, 尚胜艳, MAlla Prafulla, 宋学官, 王云鹏, 马海涛.A Computational Model for Simulation of Temperature during Radio-Frequency Ablation of Biological...[A],2018 IEEE International Conference on Computational Electromagnetics,2018,8496461-8496461
[19]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
[20]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Wang, Yunpeng, Chen, Jun, Huang, Mingliang, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613

total49 2/5

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