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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[21]马海涛, 赵宁, 王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-e...[A],2018,396-399
[22]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
[23]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
[24]Zhao, Ning, Chen, Shi, Liu, Chunying, Zhong, Yi, Ma, Haitao, Wang, Yunpeng.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
[25]Guo, Bingfeng, Huang, Ru, Yao, Jinye, Qi, Xiao, Kunwar, Anil, Wang, Yunpeng, Ma, Haitao.Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni so...[A],2018,445-449
[26]Ma, Haoran, Yao, Jinye, Wang, Chen, Shang, Shengyan, Yunpeng, Haitao.Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple ref...[A],2018,441-444
[27]Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil, Wang, Yunpeng, Haitao.Study on Electrochemical Migration of Sn-0.7Cu[A],2018,387-390
[28]Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Yao, Jinye, Ma, Haitao, Yunpeng.Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[A],2018,135-140
[29]Zhong, Y., Zhao, N., Dong, W., Qiao, Y. Y., Wang, Y. P., Ma, H. T., Liu, C. Y., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
[30]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96

total49 3/5

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