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Paper Publications

[31]Ma, Haoran, Zhao, Ning, Haitao, Kunwar, Anil, Chen, Jun, Wang, Yunpeng, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
[32]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, Wong, Ching-ping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563
[33]Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406
[34]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
[35]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
[36]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
[37]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
[38]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng, Wong, Ching-Ping.Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient[A],2017,1478-1482
[39]Kunwar, Anil, Tonks, Michael R., Shang, Shengyan, Song, Xueguan, Wang, Yunpeng, Ma, Haitao.Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn...[A],2017,1502-1507
[40]Ma, Haoran, Kunwar, Anil, Guo, Bingfeng, Sun, Junhao, Jiang, Chengrong, Wang, Yunpeng, Song, Xueguan, Zhao, Ning, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder ...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12)

total49 4/5

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