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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[41]Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., Wang, Y. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
[42]Kunwar, Anil, Ma, Haoran, Qi, Meng, Sun, Junhao, Qu, Lin, Guo, Bingfeng, Zhao, Ning, Wang, Yunpeng, Haitao.Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu J...[A],2016,608-611
[43]Kunwar, Anil, Givernaud, Julien, Ma, Haoran, Meng, Zhixian, Shang, Shengyan, Wang, Yunpeng, Haitao.Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method[A],2016,166-169
[44]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
[45]王云鹏, 宋学官, 赵宁, 马海涛.Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12):1052-1052
[46]马海涛, 王云鹏, 赵宁, 黄明亮.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder join...[J],Journal of Material Science: Materials in Electronics,2016,28(1):5398-5406
[47]邱介山, 李永峰, 王同华, 王云鹏, 赵宗彬.煤基单壁纳米管的制备[A],2004,260-266
[48]邱介山, 李永峰, 王同华, 王云鹏, 赵宗彬.煤基单壁纳米炭管的制备[A],2004,7
[49]邱介山, 李永峰, 王同华, 王云鹏, 赵宗彬, Qiu, J.(jqiu@dlut.edu.cn).煤基单壁纳米炭管的制备[J],化工学报,2004,55(8):1348-1352

total49 5/5

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