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论文类型： 会议论文

发表时间： 2016-08-16

收录刊物： EI、CPCI-S、SCIE、Scopus

页面范围： 542-545

关键字： Cross-solder interaction; Synchrotron radiation; liquid-solid interfacial reaction; intermetallic compound

摘要： Synchrotron radiation real-time imaging technology was performed to in situ study the effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn-3.0Ag-0.5Cu/Ni micro interconnects at 221 degrees C. For Cu/Sn3.0Ag- 0.5Cu interconnect, the scalloped IMC remained its shape grew slightly larger with prolonged reaction time. However, with Ni substrate added on the opposite interface, the scallop grains were split into smaller grains. Besides the opinion that Ni can improve the nucleation rate of CU6Sn5 on Cu interface and inhibit grain coarsening, the liquid soider/Cu6Sn5 interfacial energy change and the grooving effect by the addition of Ni played an important role on the growth behavior of CU6Sn5.