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论文类型：会议论文

发表时间：2014-08-12

收录刊物：EI、CPCI-S、Scopus

页面范围：429-432

关键字：Keywords Size effect; Cross-interaction; Cu/Sn-3Ag-0.5Cu/Ni-P interconnect; Interfacial reaction; Intermetallic compound

摘要：The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 pm were refk v soldered to study the size effect and cross-interaction in the solder interconnects. It was Inund that (Cu,Ni)6Sn5 type intertnetallic compounds (IMCs) formed on both Cu and Ni-P pads after soldering. The IMCs formed on the Cu pad had a scallop morphology and those formed on the Ni-P pad had a needle-type morphology. Meanwhile, cross-interaction occurred in all the C7u/Sn-3Ag-0.5CulNi-P interconnects, i.e., the Ni atoms that diffused from the Ni-P side to the Cu side refined the (Cu,Ni)6Sns at the solder/Cu interface; also, the Cu atoms diffused from the Cu side to the Ni-P side prevented the transformation of IMCs from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 at the solder/Ni-P interface. Moreover, the grain size of (Cu,Ni)6Sn5 in the 200 pm solder interconnect was larger than that in the 500 pm solder interconnect at Cu side.