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论文类型： 期刊论文

发表时间： 2014-02-01

发表刊物： SCRIPTA MATERIALIA

收录刊物： SCIE、EI、Scopus

卷号： 72-73

页面范围： 43-46

ISSN号： 1359-6462

关键字： Soldering; Synchrotron radiation; Interfacial reaction; Intermetallic compounds; Kinetics

摘要： The growth behavior of intermetallic compound (IMC) at the Sn/Cu interface during the soldering reaction was studied using synchrotron radiation real-time imaging technology. The annexation behavior of adjacent IMC grains, which slowed down with the soldering process, was directly observed for the first time. The IMC grains undergoing annexation tended to maintain a hemispherical morphology which was influenced by the radius of curvature of the nearest IMC grain. The annexation behavior was driven by the Gibbs Thomson effect. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.