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论文类型：期刊论文

发表时间：2016-10-30

发表刊物：APPLIED SURFACE SCIENCE

收录刊物：SCIE、EI、Scopus

卷号：384

页面范围：200-206

ISSN号：0169-4332

关键字：3D interconnection; Low temperature Cu-Sn bonding; Surface activation; Plasma pretreatment

摘要：The pretreatment with Ar mixed 5% H-2 plasma was applied to improve surface properties of electroplated Cu for low temperature Cu-Sn bonding in 3D interconnection. Measurement results revealed that the Ar(5% H-2) plasma effectively increased the surface activity by reducing oxygen content of the Cu surface. Lower surface roughness obtained by optimizing the pretreatment condition could help to suppress oxygen adsorption. Relationships between surface energy and surface oxygen content, surface oxygen content and surface roughness were also established. Evaluation of low temperature (200 degrees C) Cu-Sn bonding with optimal plasma pretreatment exhibited a defect-free interface and high shear strength. (C) 2016 Elsevier B.V. All rights reserved.