赵宁
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Main positions:材料科学与工程学院副院长
Gender:Male
Alma Mater:Dalian University of Technology
Degree:Doctoral Degree
School/Department:School of Materials Science and Engineering
Discipline:Materials Science
E-Mail:zhaoning@dlut.edu.cn
Hits:
Indexed by:会议论文
Date of Publication:2013-08-11
Included Journals:EI、CPCI-S、Scopus
Page Number:1094-+
Key Words:Sn-3Ag-0.5Cu solder joint; board-level drop reliability; failure mode; wafer-level chip-scale packaging (WLCSP); intermetallic compound (IMC)
Abstract:The present work evaluated the board level reliability of a kind of wafer-level chip-scale packaging (WLCSP). Drop impact tests were conducted to evaluate the lifetime and failure mode of the components before and after thermal cycles from -55 to 125 degrees C (50, 100, 150 temperature cycles) and high temperature (125 degrees C) storage (50 h, 100 h, 150 h). Under the peak acceleration of 1500 g and pulse duration of 0.5 ms, no failures were found in all of the components experienced thermal treatments after 300 drops. For the components without thermal treatments, cracks generated after 5000 drops under the shock condition with the peak acceleration of 2900 g and the pulse duration of 0.3 ms. Three kinds of failure modes were observed. The first was resin crack that generated between Cu pad and PCB; the second was internal cracks in the solder joints which generated near the IMC layer on the component side; and the third one was fracture of the Cu pad near the component. Among the above three failure modes, resin cracks most likely occurred during drop tests. The solder joints in the first row that closed to the center of PCB were checked after drop tests. Resin cracks were generally emerged at the two corners of the components. The internal cracks of solder joints tended to occur in the third solder joints, due to the resin cracks in the first and second joints released the impact energy. The cracks in Redistribution Layer (RDL) and fracture of Cu pad near the component least happened and always coexisted with the other two kinds of cracks. From the perspective of locations of components, cracks more easily generated in the components near the edge of PCB.
赵宁,工学博士,教授,博士生导师,现任材料科学与工程学院副院长。《Scientific Reports》期刊编委,IEEE会员、IEEE-EPS会员,中国电子学会(电子制造与封装技术分会)、中国材料研究学会、中国机械工程学会高级会员。
2003年本科毕业于东北大学材料物理专业,2008年博士毕业于大连理工大学材料学专业。2009年至2011年在中科院微电子研究所系统封装技术研究室从事博士后研究,2011年加入大连理工大学材料学院,同年评为副教授,2017年评为博士生导师,2018年评为教授。2016年至2017年在美国佐治亚理工学院做访问学者,合作学者为美国工程院院士、中国工程院外籍院士C.P. Wong教授。
主要从事电子封装微互连材料与技术的基础理论及应用研究,重点围绕微互连方法与成型机理,微焊点晶粒生长调控、组织演变、热迁移行为与可靠性测试分析,晶圆级互连技术,无铅焊料及BGA焊球开发与组织控制,低电阻率电镀铜膜/线等方面开展深入研究。
主持国家自然科学基金(4项)、省部级科研项目十余项,参与多项国家科技重大专项等项目。在Acta Mater.、Mater. Des.、J. Mater. Sci. Tech.、Appl. Phys. Lett.、Scripta Mater.、J. Mater. Process. Tech.、Sci. Rep.、J. Alloys Compd.、Appl. Surf. Sci.、Mater. Charact.、Intermetallics、Mater. Res. Bull.、J. Appl. Phys.、Mater. Lett.、Mater. Chem. Phys.、J. Mater. Res.、J. Electron. Mater.、物理学报、金属学报、中国有色金属学报(英文版)、稀有金属材料与工程等期刊上发表学术论文100余篇;在ECTC、ICEPT、CSTIC、EPTC等国际学术会议上发表EI论文60余篇,5次获得最佳论文奖;获中国发明专利授权25项。入选辽宁省“百千万人才工程”、大连市高层次人才计划。
指导学生:
在读硕士生11人,博士生6人。
已毕业博士生3、硕士生15人。
指导研究生多次获得国家奖学金、省优秀毕业生、市三好学生、校优秀博士/硕士研究生、优秀学位论文等荣誉。
欢迎有意从事微电子制造、微电子封装行业,具有材料、机械、物理、微电子专业背景,勤奋好学、积极乐观的学子们加入本课题组!