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论文类型：期刊论文

发表时间：2017-10-01

发表刊物：MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

收录刊物：Scopus、SCIE、EI

卷号：23

期号：10

页面范围：4957-4964

ISSN号：0946-7076

摘要：SU-8 is becoming increasingly important for fabrication of mechanical, biological and chemical mini-devices. However, SU-8 suffers from high shrinkage during curing and postbake process. It is crucial to analyze the shrinkage behavior of the SU-8. In this article, the shrinkage behavior of different SU-8 patterns was studied by a developed finite element method. A variety of concave and convex patterns (grooves, lines, pillars and holes) is simulated for 1/8 and 8 aspect ratios. The shrinkage of the patterns with different shapes and the shrinkage of the patterns with different aspect ratio were compared. The numerical simulation results show that to fabricate SU-8 structures with low shrinkage, the following patterns should be firstly considered. (1) Convex pattern, (2) high aspect ratio pattern (aspect ratio of larger than 2), and (3) circular pattern. It is expected that the proposed simulation method has a high potential for the analysis of the shrinkage process for SU-8 patterns.