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论文类型：期刊论文

发表时间：2016-12-01

发表刊物：Journal of Electrical Engineering-Elektrotechnicky Casopis

收录刊物：SCIE、Scopus

卷号：67

期号：6

页面范围：414-420

ISSN号：1335-3632

关键字：PDMS collapse; micro/nanochannel; bonding; numerical simulation

摘要：PDMS (polydimethylsiloxane) collapse method is a simple and low cost approach for micronanochannel fabrication. However, the bonding pressure which influences the size of the final PDMS micro/nanochannels has not yet been studied. In this study, the effect of the bonding pressure on the size and maximum local stress of the PDMS micronanochannels was investigated by both experimental and numerical simulation method. The results show that when the bonding pressure is lower than 0.15 MPa the experiment results can agree well with the simulation results. The fluorescent images demonstrate that there is no blocking or leakage over the entire micro/nanochannels.