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论文类型：期刊论文

发表时间：2016-08-01

发表刊物：JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

收录刊物：SCIE、EI、Scopus

卷号：16

期号：8

页面范围：8439-8444

ISSN号：1533-4880

关键字：1D Nanofluidic Chip; O-2 Plasma and Water Treatment; Thermal Bonding; PMMA; Rhodamine Filling Test

摘要：1D (one dimensional) nanofluidic chips with 1D nanochannels are becoming increasingly important for biological and chemical applications. However, the majority of the present fabrication methods suffer from high dimension loss and low bonding strength. To address these issues, a new thermal bonding technique based on O-2 plasma and water treatment was developed. By this technique, the 1D PMMA nanofluidic chip can be bonded at low bonding temperature of 85 degrees C, bonding pressure of 0.3 MPa and bonding time of 15 min. The O-2 plasma parameters and thermal bonding parameters were also optimized during bonding process to further increase the bonding rate and bonding strength of the chip. The experiment results show that the bonding rate and bonding strength can be 95.3% and 0.438 MPa, respectively. The Rhodamine filling test demonstrates that there is no leakage and block in the entire 1D PMMA nanofluidic chip.