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个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:威尔大学
学位:博士
所在单位:机械工程学院
学科:微机电工程
办公地点:机械工程学院2号楼214-2
联系方式:办公电话:0411-84709754
电子邮箱:zouhl@dlut.edu.cn
A novel 2D silicon nano-mold fabrication technique for linear nanochannels over a 4 inch diameter substrate
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论文类型:期刊论文
发表时间:2016-01-11
发表刊物:SCIENTIFIC REPORTS
收录刊物:SCIE、PubMed
卷号:6
页面范围:18921
ISSN号:2045-2322
摘要:A novel low-cost 2D silicon nano-mold fabrication technique was developed based on Cu inclined-deposition and Ar+ (argon ion) etching. With this technique, sub-100 nm 2D (two dimensional) nanochannels can be etched economically over the whole area of a 4 inch n-type <100> silicon wafer. The fabricating process consists of only 4 steps, UV (Ultraviolet) lithography, inclined Cu deposition, Ar+ sputter etching, and photoresist & Cu removing. During this nano-mold fabrication process, we investigated the influence of the deposition angle on the width of the nano-channels and the effect of Ar+ etching time on their depth. Post-etching measurements showed the accuracy of the nanochannels over the whole area: the variation in width is 10%, in depth it is 11%. However, post-etching measurements also showed the accuracy of the nanochannels between chips: the variation in width is 2%, in depth it is 5%. With this newly developed technology, low-cost and large scale 2D nano-molds can be fabricated, which allows commercial manufacturing of nano-components over large areas.