Release Time:2019-03-09 Hits:
First Author: Dejun WANG
Disigner of the Invention: Qin Fuwen,李青洙
Application Number: CN201510671058.3
Authorization Date: 2015-10-15
Authorization Number: CN105304498A
Prev One:一种β-碳化硅薄膜的制备方法
Next One:一种提高碳化硅半导体欧姆接触特性的方法