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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别:男
毕业院校:西北工业大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点:机械工程学院7191
电子邮箱:kangrk@dlut.edu.cn
扫描关注
- [201]Guo D., Xu C., Kang R., Jin Z., Xu, C., Key Laboratory for Precision, Non-Traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: xuchidut@163.com.Model analysis and experimental investigation of the friction torque during the CMP process[J],Journal of Semiconductors,2011,32(3)
- [202]Su, Jianxiu, Du, Jiaxi, Chen, Xiqu, Ning, Xin, Kang, Renke.Experiment on Non-Uniformity of Material Removal on Wafer surface in Wafer CMP[A],2011,175:187-+
- [203]Wang Xuyue, Meng Qingxuan, Kang Renke, Xu Wenji, Guo Dongming, Wang Lianji.Vapor-melt Ratio in Laser Fine Cutting of Slot Arrays[A],2011,1353:657-662
- [204]康仁科, 高航.Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel[A],2011,487:1-5
- [205]康仁科, 金洙吉, 董志刚.Research on the Polishing Performance of CMP Slurry for the Sapphire Crystal[A],2011,325:457-463
- [206]苏建修, Du, J.X., Liu, X.L., H.N., 康仁科.Study on Lubricating Behavior in Chemical Mechanical Polishing[A],2011,487:243-247
- [207]Zhang, Shengfang, Su, Jianxiu, Du, Jiaxi, Kang, Renke.Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior[A],2010,704-705:313-+
- [208]Wang, K., Sheng, X., Kang, R., K (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Volumetric error modelling, measurement, and compensation for an integrated measurement-process...[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE,2010,224(C11):2477-2486
- [209]苏建修, 陈锡渠, 杜家熙, 宁欣, 康仁科.硅片化学机械抛光表面材料去除非均匀性实验[J],超硬材料工程,2010,22(5):1-4
- [210]Zhu, X., Kang, R., Wang, Y., Guo, D., XL (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Development of three-dimensional dynamometer for wafer grinder[J],Advanced Materials Research,2010,126-128:361-366
- [211]鲁春朋, 高航, 滕晓辑, 郭东明, 王景贺, 王奔, 康仁科, Gao, H.(gaohang@dlut.edu.cn).磷酸二氢钾单晶体纳米压痕的力学行为[J],机械工程学报,2010,46(17):192-198
- [212]袁巨龙, 张飞虎, 戴一帆, 康仁科, 杨辉, 吕冰海, Yuan, J.(jlyuan@hnu.edu.cn).超精密加工领域科学技术发展研究[J],机械工程学报,2010,46(15):161-177
- [213]鲁春朋, 高航, 王奔, 郭东明, 腾晓辑, 康仁科, 吴东江, Gao, H.(gaohang@dlut.edu.cn).磷酸二氢钾晶体单点划痕试验研究[J],机械工程学报,2010,46(13):179-185
- [214]Dong, Zhigang, Huang, Han, Kang, Renke, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..An investigation of the onset of elastoplastic deformation during nanoindentation in MgO single...[J],MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2010,527(16-17):4177-4184
- [215]Li, Yan, Kang, Renke, Gao, Hang, Wu, Dongjiang, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116023, Peoples R China..Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers[J],MATERIALS AND MANUFACTURING PROCESSES,2010,25(6):412-417
- [216]Li Yan, Kang Renke, Gao Hang, Wu Dongjiang, Kang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Non Tradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Damage mechanisms during lapping and mechanical polishing CdZnTe wafers[J],RARE METALS,2010,29(3):276-279
- [217]Li, Yan, Gao, Hang, Kang, Renke, Wu, Dongjiang, H (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian, Peoples R China..Anisotropic Damage Mechanism during Grinding of CdZnTe Wafers[J],MATERIALS AND MANUFACTURING PROCESSES,2010,25(6):407-411
- [218]刘瑞鸿, 郭东明, 金洙吉, 康仁科, Guo, D.-M.(guodm@dlut.edu.cn).摩擦化学反应活化能在SiO2-CMP中的作用[J],纳米技术与精密工程,2010,08(3):275-280
- [219]Zhang, Zhenyu, Guo, Dongming, Kang, Renke, Gao, Hang, Jin, Zhuji, Meng, Yaowu, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZn...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2010,47(9-12,SI):1065-1081
- [220]Zhang, Zhenyu, Meng, Yaowu, Guo, Dongming, Kang, Renke, Gao, Hang, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Nanoscale machinability and subsurface damage machined by CMP of soft-brittle CdZnTe crystals[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2010,47(9-12,SI):1105-1112