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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别:男
毕业院校:西北工业大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点:机械工程学院7191
电子邮箱:kangrk@dlut.edu.cn
扫描关注
- [181]朱祥龙, 董志刚, 康仁科, 郭东明.Development of ultra-precision grinder for 300mm wafers[A],2012,565:609-614
- [182]董志刚, 康仁科.Experimental investigation on ultrasonic assisted grinding of high volume fraction sic particles ...[A],2012,565:142-147
- [183]周平, 康仁科, 金洙吉, 郭东明.Simulation of CMP Process Based on Mixed Elastohydrodynamic Lubrication Model with[A],2012
- [184]董志刚, 周平, 康仁科, 郭东明.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[A],2012,565:105-110
- [185]Yuan, Zewei, Jin, Zhuji, Kang, Renke, Wen, Quan, ZW (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Tribochemical polishing CVD diamond film with FeNiCr alloy polishing plate prepared by MA-HPS t...[J],DIAMOND AND RELATED MATERIALS,2012,21:50-57
- [186]Zhou, Ping, Guo, Dongming, Kang, Renke, Jin, Zhuji, P (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzman...[J],JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME,2012,134(1)
- [187]金钊, 孟晓辉, 王永刚, 张继友, 康仁科, 李锦胜, Jin, Z., Beijing Institute of Space Mechanics, Electronics, Beijing 100076, China, email: gk_110@163.com.应用软磨料磨削的单晶硅超精密制造技术[J],光电工程,2011,38(12):75-80,84
- [188]Ma, F. J., Guo, D. M., Kang, R. K., Ren, Y. J., FJ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Surface quality of carbon/carbon composite after ultrasonic assisted turning[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2011,225(B11):2144-2148
- [189]Wang, Xuyue, Kang, Renke, Xu, Wenji, Guo, Dongming, Jun, XY (reprint author), Dalian Univ Technol, Sch Mech Engn, Key Lab Precis & Nontradit Machining Technol, Dalian 116023, Peoples R China..A THRESHOLD MODEL FOR LASER CLEANING OF LARGER SILICON WAFERS[J],MACHINING SCIENCE AND TECHNOLOGY,2011,15(4):415-428
- [190]Zhu X., Kang R., Dong Z., Feng G., Kang, R., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: kangrk@dlut.edu.cn.Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder[J],Journal of Semiconductors,2011,32(10)
- [191]孟庆轩, 王续跃, 徐文骥, 康仁科, 郭东明, Wang, X.(wbzzd@dlut.edu.cn).薄板激光切割气熔比数学建模及试验验证[J],机械工程学报,2011,47(17):172-178
- [192]Zhu, X. L., Kang, R. K., Feng, G., Lv, H. M., XL (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Liaoning, Peoples R China..Research on topography control of two-spindle and three-workstation wafer grinder[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE,2011,225(C9):2232-2241
- [193]周平, 郭东明, 康仁科, 金洙吉, Zhou, P.(pzhoug.zj.cn@gmail.com).多级粗糙间隙内的两相微流动数值模拟[J],机械工程学报,2011,47(15):83-88
- [194]Li Yan, Jie Wanqi, Kang Renke, Gao Hang, Kang, RK (reprint author), Dalian Univ Technol, Minist Educ China, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Effect of mechanical anisotropy on material removal rate and surface quality during polishing C...[J],RARE METALS,2011,30(4):381-386
- [195]马付建, 康仁科, 郭东明, 方胜, 任宇江.三维编织碳纤维复合材料超声辅助车削可行性分析[J],宇航材料工艺,2011,41(3):65-69
- [196]Zhang Yinxia, Kang Renke, Gao Wei, Wang Dong, Zhang, YX (reprint author), Zhengzhou Univ, Sch Mech Engn, Zhengzhou 450001, Peoples R China..Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding[J],RARE METALS,2011,30(3):278-281
- [197]Tang K., Kang R., Tang, K., Automatic Engineering Department, Engineering, Technical College of Chengdu University of Technology, Leshan, Sichuan, 614007, China, email: tankwang1314@163.com.Simulation on the ground wafer shape in wafer rotational grinding[J],Journal of Advanced Manufacturing Systems,2011,10(1):175-182
- [198]周平, 郭东明, 康仁科, 金洙吉, Zhou, P.(pzhoug.zj.cn@gmail.com).多级粗糙表面对抛光液微流动影响的数值分析[J],机械工程学报,2011,47(9):169-174
- [199]张银霞, 郜伟, 康仁科, 李大磊, Zhang, Y.-X.(zhangyinxia@zzu.edu.cn).硅片加工表面层损伤检测技术的试验研究[J],人工晶体学报,2011,40(2):359-364
- [200]Huo, F. W., Guo, D. M., Jin, Z. J., Kang, R. K., Zhang, Z. Y., DM (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Ultra-precision grinding of a hydrostatic mechanical sealing ring face with extremely shallow t...[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2011,225(B4):463-472