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Effect of the Thickness Uniformity in Micro-electroforming Process by Dividing Conductive Zone on Cathode

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Indexed by:会议论文

Date of Publication:2008-11-19

Included Journals:EI、CPCI-S、Scopus

Volume:60-61

Page Number:202-+

Key Words:Thickness uniformity; Electroforming; Conductive zone; Current density

Abstract:In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming, processes, thickness ratio of edge to center is 2.5 similar to 4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.

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