Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate
Release Time:2016-12-06 Hits:
Indexed by: Journal Papers
Date of Publication: 2019-03-29
Journal: Ultrasonics Sonochemistry
Included Journals: EI、SCI
Volume: 29
Page Number: 1-10
Note: SCI 一区，IF：4.959