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Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro electroforming process

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Indexed by:Journal Papers

Date of Publication:2018-05-03

Journal:Journal of Micromechanics and Microengineering

Included Journals:SCI、EI

Discipline:Engineering

Volume:28

Issue:7

Page Number:075017

Pre One:Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests

Next One:Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate
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