location： Current position: Home >> Scientific Research >> Paper Publications

Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests

Hits:

Indexed by:Journal Papers

Date of Publication:2014-12-05

Journal:JOURNAL OF APPLIED POLYMER SCIENCE

Included Journals:SCI、EI

Volume:133

Issue:24

Page Number:411081-411089

Note:JCR二区，IF：1.866（2015）

Pre One:Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment

Next One:Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro electroforming process
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep