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Indexed by:Journal Papers
Date of Publication:2010-11-09
Journal:SCIENCE CHINA - TECHNOLOGICAL SCIENCES
Included Journals:SCI、EI
Volume:55
Issue:11
Page Number:3006-3013
Note:JCR二区,IF:1.441(2015)
Pre One:Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer
Next One:Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests