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Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer

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Indexed by:Journal Papers

Date of Publication:2010-12-01

Journal:Microelectronic Engineering

Included Journals:SCI、EI

Volume:87

Issue:12

Page Number:2555–2560

Note:JCR二区，IF：1.227（2015）

Pre One:Residual stress measurement in a metal microdevice by micro Raman spectroscopy

Next One:Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment
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