Release Time:2021-03-29 Hits:
Indexed by: Journal Article
Date of Publication: 2021-03-21
Journal: 电加工与模具
Issue: 1
Page Number: 47-52
Prev One:Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate
Next One:金属微通道热沉换热特性仿真与实验研究