Fabrication of high-density micro column chip mould using micro electroforming technology assisted by megasonic field and electrochemical etching
Release Time:2024-08-31 Hits:
Date of Publication: 2024-08-28
Volume: 496
ISSN: 1385-8947
Key Words: ADHESION STRENGTH; ELECTRODEPOSITION; HYDROGEN; LAYER; NICKEL; ULTRASONIC AGITATION; UNIFORMITY