Fabrication of high-density micro column chip mould using micro electroforming technology assisted by megasonic field and electrochemical etching
Release Time:2024-08-31 Hits:
Indexed by: Journal Papers
Document Code: 395768
Date of Publication: 2024-09-15
Journal: CHEMICAL ENGINEERING JOURNAL
Volume: 496
ISSN: 1385-8947
Key Words: ADHESION STRENGTH; ELECTRODEPOSITION; HYDROGEN; LAYER; NICKEL; ULTRASONIC AGITATION; UNIFORMITY