Current position: Home >> Scientific Research >> Patents

集成厚度可控绝缘层的非接触电导检测微芯片制作方法

Hits:

First Author:liujunshan

Disigner of the Invention:徐飞,Chong Liu,xuzheng,duliqun,wangliding

Application Number:CN201210132614.6

Authorization Date:2012-05-02

Authorization number:CN102641759A

Pre One:聚合物微流控芯片基片与盖片一体化注塑成型模具

Next One:一种金属基底上制作多层金属可动微结构的方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep