Current position: Home >> Scientific Research >> Patents

集成厚度可控绝缘层的非接触电导检测微芯片制作方法

Release Time:2019-03-09  Hits:

First Author: 刘军山

Disigner of the Invention: 王立鼎,杜立群,徐征,Chong Liu,徐飞

Application Number: CN201210132614.6

Authorization Date: 2012-05-02

Authorization Number: CN102641759A

Prev One:聚合物微流控芯片基片与盖片一体化注塑成型模具

Next One:一种金属基底上制作多层金属可动微结构的方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep