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一种提高注塑成型PMMA微流控芯片热压键合率的方法

Release Time:2016-08-09  Hits:

Disigner of the Invention: 杜立群,常宏玲,付其达,Chong Liu

Institution: 机械工程学院

Application Date: 2011-03-24

Application Number: 2011100795433

Authorization Date: 2013-10-16

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