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一种提高注塑成型PMMA微流控芯片热压键合率的方法

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Disigner of the Invention:Chong Liu,付其达,常宏玲,duliqun

Affilication of Author(s):机械工程学院

Application Date:2011-03-24

Application Number:2011100795433

Authorization Date:2013-10-16

Pre One:一种提高微电铸器件尺寸精度的超声处理方法
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