Release Time:2016-08-09 Hits:
Disigner of the Invention: 杜立群,贾胜芳,李永辉,Chong Liu,刘军山,徐征
Institution: 机械工程学院
Application Date: 2010-04-16
Application Number: 201010149262.6
Authorization Date: 2012-08-01
Prev One:一种提高注塑成型PMMA微流控芯片热压键合率的方法
Next One:一种提高微电铸器件尺寸精度的超声处理方法