![]() |
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:女
毕业院校:东北大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 微机电工程. 机械电子工程
办公地点:西部校区机械学院新大楼6009房间
电子邮箱:duliqun@dlut.edu.cn
扫描关注
- [41]闫卫平, 杜立群, 朱剑波, 马灵芝, Yan, W.-P.(yanwp@126.com).金属薄膜加热器的研究[J],传感技术学报,2004,17(4):615-618
- [42]赵雯, 吕辉, 翟科, 宋满仓, 魏壮壮, 姬学超, 杜立群.高密集金属微通道散热器成形及封装工艺研究[J],航空制造技术,2019,62(19):92-98
- [43]Liu, Junshan, Hu, Xiaoguang, Cai, Yindi, Zhe, Zehan, Xu, Zheng, Zhang, Xi, Du, Liqun, Wang, Zelong, JS (reprint author), Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China., Liu, Key Lab Precis & Nontradit Machining Technol, Minist Educ.Transfer printing via a PAA sacrificial layer for wrinkle-free PDMS metallization[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(3):2347-2352
- [44]Du, L. Q., Chen, S. L., Zhao, M., Tao, Y. S., Luo, L., Yang, T., Liu, S. J., Hao, Y. P..Research on Fabrication of a Multi-Scale Inertial Switch with Ultra-High Aspect Ratio[A],2018,243-249
- [45]杜立群, 王伟泰, 杜成权, 刘旭强, 赵剑.基于微电铸工艺的镍微型惯性开关的研制[J],电加工与模具,2019,2:47-51
- [46]Zhao, Ming, Zhang, Xi, Cao, Qiang, Ji, Xuechao, Wei, Zhuangzhuang, Liu, Junshan, Du, Liqun, Xu, Zheng, LQ, Liu, JS (reprint author), Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Liaoning, Peoples R China..Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,239
- [47]Song C., Du L., Yang T., Luo L., Tao Y., Zhang X., Du, L., Key Laboratory for Micro/Nano Technology, System of Liaoning Province, Dalian University of TechnologyChina.Experimental study on the relationship between dislocation density and internal stress in micro e...[J],Key Engineering Materials,2015,645:405-410
- [48]杜立群, 赵文君, 翟科, 杜成权, 魏壮壮, 姬学超.基于纳米压痕技术的兆声辅助电铸微器件残余应力研究[J],电加工与模具,2019,4:44-48,68
- [49]Zhai, Ke, Du, Liqun, Wen, Yikui, Wang, Shuxuan, Cao, Qiang, Zhang, Xi, Liu, Junshan, Liqun(duliqun@dlut.edu.cn).Fabrication of micro pits based on megasonic assisted through-mask electrochemical micromachining[J],Ultrasonics,2020,100:105990
- [50]李晓军, 吕辉, 朱和卿, 赵雯, 杜立群.雷达用高深宽比金属铜微通道散热器的制作[J],航空制造技术,2019,62(1):95-100
- [51]朱和卿, 吕辉, 赵雯, 姬学超, 魏壮壮, 杜立群.金属微通道散热器结构微电铸均匀性研究[J],电加工与模具,2019,1:43-48,51
- [52]吕辉, 王仁彻, 严战非, 沈涛, 杜立群.金属微通道结构UV-LIGA精密成形技术研究[J],电子机械工程,2018,34(6):39-42
- [53]Song, Chang, Du, Liqun, Ji, Xuechao, LQ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Du, Key Lab Micro Nano Technol & Syst Liaoning Prov.Reducing the residual stress in micro electroforming layer by megasonic agitation[J],ULTRASONICS SONOCHEMISTRY,2018,49:233-240
- [54]杜立群, 翟科, 姬学超, 魏壮壮, 杜成权, 刘旭强.兆声波精密微电铸设备及相关工艺研究[J],航空制造技术,2018,61(21):52-56
- [55]Du, Liqun, Zhao, Wenjun, Zhai, Ke, Song, Chang, Li, Qingfeng, LQ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Du, Key Lab Micro Nano Technol & Syst Liaoning Prov.Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro e...[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2018,28(7)
- [56]杜立群, 齐磊杰, 朱和卿, 赵雯, 阮久福.基于电化学沉积的金属基微射频T形功分器研制[J],电加工与模具,2018,3:26-30,44
- [57]杜立群, 阮久福, 赵雯, 朱和卿, 李晓军, 齐磊杰, 李爰琪.高精度AZ厚胶光刻及在微型射频同轴器制作中的应用[J],航空制造技术,2018,61(9):26-31
- [58]Du Liqun, Li Yu, Zhao Jian, Wang Weitai, Zhao Wenjun, Zhao Wen, Zhu Heqing, Du, LQ (reprint author), Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China..A low-g MEMS inertial switch with a novel radial electrode for uniform omnidirectional sensitiv...[J],SENSORS AND ACTUATORS A-PHYSICAL,2018,270:214-222
- [59]高林松, 吕继组, 白敏丽, 胡成志, 杜立群.微米结构表面强化沸腾传热实验研究[A],2018
- [60]Song, Chang, Du, Liqun, Qi, Leijie, Li, Yu, Xiaojun, Yuanqi, LQ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Du, Key Lab Micro Nano Technol & Syst Liaoning Prov.Residual stress measurement in a metal microdevice by micro Raman spectroscopy[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2017,27(10)