Personal Information

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[11]Shang, Shengyan, Wang, Yunpeng, Ma, Haitao, Qi, Xiao, Yanfeng, Kunwar, Anil, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and elect...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2018,124(7)
[12]Ma, H. R., Kunwar, A., Shang, S. Y., Jiang, C. R., Wang, Y. P., H. T., Zhao, N., HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during mul...[J],INTERMETALLICS,2018,96:1-12
[13]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[14]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[15]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[16]Zhao, N., Wang, M. Y., Zhong, Y., Ma, H. T., Y. P., Wong, C. P., N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[17]Kunwar, Anil, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
[18]Yao, Mingjun, Zhao, Ning, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao.Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesiv...[A],2018,241-246
[19]Zhao, Ning, Chen, Shi, Liu, Chunying, Zhong, Yi, Ma, Haitao, Wang, Yunpeng.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
[20]马海涛, 赵宁, 王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-e...[A],2018,396-399

total225 2/23

first previous next last Page

Home

Scientific Research

Teaching Research

Awards and Honours

Enrollment Information

Student Information

My Album

Blog

Personal Information

Paper Publications