Personal Information

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[21]周长海, Li, XW, Wang, SH, 马海涛.Magnetic effect on oxide-scale growth of Fe-5Cr alloy[A],2018,292(UNSP 012090)
[22]Kunwar Anil, Raback Peter, 尚胜艳, MAlla Prafulla, 宋学官, 王云鹏, 马海涛.A Computational Model for Simulation of Temperature during Radio-Frequency Ablation of Biological...[A],2018 IEEE International Conference on Computational Electromagnetics,2018,8496461-8496461
[23]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
[24]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Wang, Yunpeng, Chen, Jun, Huang, Mingliang, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
[25]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[26]A. Kunwar, 马浩然, 马海涛, J.H. Sun, 赵宁, 黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid...[J],Materials Letter,2018,230:76-76
[27]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
[28]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
[29]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Song, Xueguan, Malla, Prafulla Bahadur, Wang, Yunpeng, Ma, Haitao.A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes[A],2018,1329-1332
[30]Guo, Bingfeng, Huang, Ru, Yao, Jinye, Qi, Xiao, Kunwar, Anil, Wang, Yunpeng, Ma, Haitao.Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni so...[A],2018,445-449

total225 3/23

first previous next last Page

Home

Scientific Research

Teaching Research

Awards and Honours

Enrollment Information

Student Information

My Album

Blog

Personal Information

Paper Publications