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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[31]Ma, Haoran, Yao, Jinye, Wang, Chen, Shang, Shengyan, Yunpeng, Haitao.Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple ref...[A],2018,441-444
[32]Ji, Shengnan, Wang, Chen, Yunpeng, Ma, Haitao, Zhao, Ning.Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective bac...[A],2018,396-399
[33]Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil, Wang, Yunpeng, Haitao.Study on Electrochemical Migration of Sn-0.7Cu[A],2018,387-390
[34]Huang, Ru, Xia, Mengrou, Yao, Jinye, Wang, Boyin, Qi, Xiao, Qiao, Junshan, Ma, Haitao.Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow[A],2018,391-395
[35]Yao, Jinye, Li, Hua, Huang, Ru, Qi, Xiao, Wang, Boyin, Qiao, Junshan, Yunpeng, Ma, Haitao.Mechanism of Cu5Zn8 layer act as a diffusion barrier layer[A],2018,383-386
[36]Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Yao, Jinye, Ma, Haitao, Yunpeng.Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[A],2018,135-140
[37]Zhong, Y., Ma, H. T., Wang, Y. P., Qiao, Y. Y., Dong, W., Liu, C. Y., Zhao, N., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
[38]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
[39]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
[40]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, Wong, Ching-ping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563

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