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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[41]Ma, H.R., Wang, Y.P., Chen, J., H.T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
[42]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
[43]Yao, Mingjun, Fan, Jun, Zhao, Ning, Xiao, Zhiyi, Yu, Daquan, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhe...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):9091-9095
[44]Zhao, N., Yao, M. J., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluor...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):8824-8831
[45]Zhao, N., Deng, J. F., Zhong, Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Unde...[J],JOURNAL OF ELECTRONIC MATERIALS,2017,46(4):1931-1936
[46]Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406
[47]Yao, Mingjun, Zhao, Ning, Fan, Jun, Xiao, Zhiyi, Ma, Haitao, Yu, Daquan.DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR B...[A],2017
[48]Zhao, N., Zhong, Y., Dong, W., Huang, M. L., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
[49]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
[50]Kunwar, Anil, Tonks, Michael R., Shang, Shengyan, Song, Xueguan, Wang, Yunpeng, Ma, Haitao.Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn...[A],2017,1502-1507

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