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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[51]赵宁, 董伟, 黄明亮, 马海涛.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
[52]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., Wong, C. P..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
[53]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Chen, Jun.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
[54]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
[55]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
[56]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
[57]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng, Wong, Ching-Ping.Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient[A],2017,1478-1482
[58]Shang, Shengyan, Kunwar, Anil, Wu, Yingchao, Ma, Haitao.Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu S...[A],2017,1577-1581
[59]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
[60]Ma, Haoran, Kunwar, Anil, Guo, Bingfeng, Sun, Junhao, Jiang, Chengrong, Wang, Yunpeng, Song, Xueguan, Zhao, Ning, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder ...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12)

total225 6/23

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